The sizes of PCB lines and traces can vary widely depending on the specific design requirements, the technology used in manufacturing, and the application of the PCB. Here are some typical sizes for different types of PCB traces:

  1. Minimum Trace Width and Spacing: The minimum trace width and spacing are determined by the capabilities of the PCB fabrication process. Standard minimum values for a typical 2-layer PCB might be around six mils (0.006 inches) for trace width and spacing. However, advanced processes can achieve much finer widths and spacings.
  2. High-Speed Traces: For high-speed signals, like those used in high-frequency applications or digital signals with fast edges, trace widths need to be wider to maintain signal integrity and prevent impedance mismatches. These traces could range from 10 mils to 20 mils or even more expansive, depending on the specific requirements of the design.
  3. Power Traces: Traces that carry higher currents, such as power supply lines or ground planes, must be wider to handle the current without excessive heat buildup. These can range from 20 mils and wider depending on the current requirements.
  4. Differential Pairs: In differential signal routing (used in applications like USB, Ethernet, HDMI), maintaining a consistent spacing between the two traces is crucial for maintaining signal balance. The spacing might be 4 to 8 mils, while the trace width could be around 8 to 12 mils.
  5. Controlled Impedance Traces: For specific high-frequency applications, like RF circuits, controlled impedance traces are necessary. The desired impedance value and the dielectric properties of the material will define the spacing of the PCB lines and traces.
  6. Flex PCBs: Flexible PCBs might have wider traces due to the need for mechanical flexibility. Trace widths in flex PCBs could range from 8 to 15 mils.
  7. Fine-Pitch Components: When dealing with fine-pitch components like BGAs (Ball Grid Arrays), the trace width and spacing might be limited by the pitch of the component’s pads. This could result in very fine traces ranging from 3 to 5 mils.
  8. Manufacturing Technology: Advanced manufacturing technologies, such as HDI (High-Density Interconnect) and micro-via techniques, enable much finer traces and spacings than traditional manufacturing methods.

It’s important to note that these values are just general guidelines and can vary based on factors like the specific PCB fabrication process, the layer count of the PCB, the type of signals being routed, the thermal characteristics required, and more. Always consult with your PCB manufacturer and consider the design guidelines provided by them for the specific manufacturing process you’re using.