ANZER’s investment in the latest production equipment is vital to our efficiency, cost-effectiveness, and value improvement. We consider new assets to provide quality electronic assembly results and timely and consistent electronic manufacturing services. It is an ongoing process to enhance our throughput with the latest advancements in tools and automation. The more accurate the equipment, the more precise the final electronic assembly. Our newest acquisitions consist of the following:
Equipment
MYCRONIC MY300LX™: Pick-and-Place Machine
- Improved Production Efficiency in SMT Assembly
- Enhanced Throughput/Component Placement Accuracy
- State-of-the-Art Fine-Pitch Precision
- Increased Utilization of Miniature Components
- Electronic Manufacturing Services Enhancement
CYBER OPTICS QX500-L: Automated Optical Inspection (AOI)
- Confirms Component Orientation
- Lowers Human Visual Inspection Requirement
- Fast Inspection with SIM (Strobed Inspection Module)
- SMT Prototypes Utilize AOI
EKRA XPTR5: Automatic Inspection Stencil Printer
- Advanced Solder Paste Inspection (SPI) Capabilities
- Improved Electronic Manufacturing Services
- SMT Assembly Exactness
- High Precision Alignment & Repeatability
- Quick Product Changeover in < 5 Minutes
VITRONICS XPM2: Reflow Soldering System
- Top and Bottom Convection Heating and Cooling
- Electronic Assembly Consistency
- High Mass Quick Response Aluminum Heater
- Industry Leading Thermal Performance for Uniformity and Consistency
- Repeatability of SMT prototype and SMT Assembly