IPC Total Quality Management

Quality

ANZER is an ISO 9001:2015, ISO 13485:2016 (medical) and AS9100:2016 (aerospace) certified electronics design and manufacturing service provider for Original Equipment Manufacturers (OEMs) needing turnkey, custom-engineered solutions. We train and certify our manufacturing personnel, ensuring accuracy throughout the entire process. Additionally, to exceed our customer quality expectations, we foster individual commitment from all employees. By making it each and everyone’s top priority, at all levels in the organization, zero defects can be realized.

Quality is at the core of what we do. Led by a veteran Quality Control Manager who handles our ongoing continuous improvement goals. Whether cross-training our many IPC-certified staff members or implementing new documentation procedures, quality outcomes are paramount.

Printed circuit board with component layouts for electronics manufacturing

Third-Party Quality Assurance Consultant

As a further commitment to quality, we have employed a world-class expert who has brought oversight to our internal self-certifying objectives. Auditing our documentation, procedures, and process accuracy adds another layer of quality assertion. Holding three (3) advanced degrees including a Master of Science in Total Quality Management. He is skilled in analytical chemistry, quality control, quality assurance, quality systems, and regulatory affairs.

PCB assembly company team discussion in a modern office

ISO 13485:2016 Medical Device Certified

Devised to be used in companies that design, produce, install, and/or service medical devices. Often used by internal and third-party entities to help with their auditing processes. Becoming certified in medical device design and manufacturing aligns with our expanding capability goals.

Medical device displaying patient vitals signs on screen

Quality Management Blog

X-Ray Inspection for BGA Components: Complete Guide (2026)
by Jay Mendpara

X-Ray Inspection for BGA Components: Complete Guide (2026)

X-ray inspection (AXI) is the only reliable method to verify BGA and leadless component solder joints because these connections are hidden beneath the package. Visual and optical inspection can’t see under the component. X-ray reveals voids, insufficient solder, bridging, and misalignment – defects that cause...

Master design for testability PCB strategies with proper test point placement for ICT. Learn sizing, spacing, and accessibility rules that ensure reliable testing.
by Jay Mendpara

Design for Testing (DFT) PCB: How to Place Test Points for ICT

Key Takeaways What Is Design for Testability (And Why It Matters More Than Ever) Design for testability (DFT) is the practice of designing PCBs so manufacturing defects can be detected quickly, reliably, and cost-effectively. Your circuit might be perfect, but if you can’t verify that...

IPC-A-610 Certification Importance: Verifying the Previous Person's Work
by Gary Rothstein

IPC-A-610 Certification Importance: Verifying the Previous Person’s Work

In electronic manufacturing, verifying and validating the work done by the previous person is crucial to ensure quality and reliability. This form of in-process “Quality Control” (QC) and “Quality Assurance” (QA) is one method used by ANZER to take advantage of each team member’s IPC-A-610 certification....