
Q: What is PCB Assembly Reflow Oven Temperature Range
FAQ, PCB Assembly
A: In PCB assembly, the typical temperature range for a Printed Circuit Board (PCB) reflow oven is approximately 100°C to 300°C (212°F to 572°F). This range accommodates the various stages of solder paste application, component soldering, and thermal profiles required for different soldering processes.

Gary Rothstein
Gary (ANZER Sales & Marketing Director) is an Electrical Engineer with over 30 years of experience in high-technology electronics design and application engineering. He has extensive experience managing technology-based businesses and founded two electronics companies. He works with Original Equipment Manufacturers (OEMs) needing outsourced electronic manufacturing and holds patents in electronic safety devices.