PCB-to-Wire Connections: Pull Test Validating
A pull test for PCB-to-wire connections is a mechanical test used to determine the strength of the connection between a printed circuit board (PCB) and a wire or cable. This test ensures that the soldered or crimped connections between the wires and the PCB pads…
MIL-STD-202: Reliability & Durability Testing
MIL-STD-202 is a United States Military Standard that outlines test methods and procedures for the environmental and mechanical testing of electronic and electrical components and equipment. This standard aims to establish uniform test methods to evaluate the performance and reliability of these components and equipment…
Electronic Manufacturing Equipment Calibration Importance
Manufacturing equipment calibration is a process used to ensure that measurement and testing instruments used in manufacturing processes are accurate and provide reliable results. Calibration involves comparing the measurements taken by a particular instrument to a known, standardized reference value. If any discrepancies are found,…
Electronic Manufacturing Equipment Traceability Described
Electronic manufacturing equipment traceability refers to the ability to track and document the various stages and components involved in the manufacturing process of electronic products. It involves capturing and recording information about the materials, processes, and personnel involved in producing electronic devices, such as printed…
Q: What is PCB Acceptability: IPC-A-600
A: IPC-A-600 is a widely recognized standard in the electronics industry. It is published by the IPC (Association Connecting Electronics Industries) and is titled “Acceptability of Printed Boards.” This standard establishes the criteria for the acceptability of printed circuit boards (PCBs) in terms of quality,…
About IPC J-STD-001: Electronics Industry Soldering Standards
IPC J-STD-001 is a widely recognized standard in the electronics industry that provides requirements for the manufacturing and assembly electronic assemblies. It is officially titled “Requirements for Soldered Electrical and Electronic Assemblies.” The IPC (Institute of Printed Circuits), now known as IPC-Association Connecting Electronics Industries,…
Finding Gold Plating on PCBs
The gold plating on PCBs is commonly used for various reasons, primarily due to its excellent electrical properties and corrosion resistance. Here are some key reasons why gold plating is used on PCBs: It’s worth noting that while gold offers numerous benefits, it is also…
PCB Lines and Traces: Why Size Matters
The sizes of PCB lines and traces can vary widely depending on the specific design requirements, the technology used in manufacturing, and the application of the PCB. Here are some typical sizes for different types of PCB traces: It’s important to note that these values…
Q: Explain Printed Circuit Board Vias
A: PCB Vias, short for “Printed Circuit Board Vias,” are essential components in electronic circuit design. A PCB Via is a conductive hole or pathway connecting different multilayer printed circuit board layers. They provide a means for electrical signals and power to pass between the…
Q: What is Hot-Swapping Electronics Under Power
A: Hot-swapping electronics under power refers to adding, removing, or replacing electronic components or modules within a system while the system is operational and powered on. This is achieved without interrupting the system’s functionality or shutting it down. The primary goal of hot-swapping is to…
Q: International Electrotechnical Commission (IEC): What Purpose
A: The International Electrotechnical Commission (IEC) is an international standardization organization that develops and publishes standards for electrical, electronic, and related technologies. Founded in 1906, the IEC is crucial in creating global standards that facilitate the interoperability, safety, and efficiency of electrical and electronic devices,…
Q: Electromagnetic Emissions: Harmful or Not
A: Electromagnetic emissions refer to releasing electromagnetic energy through waves or particles. Electromagnetic energy is a fundamental force responsible for many phenomena, including light, radio waves, microwaves, X-rays, and gamma rays. These emissions are produced by moving charged particles, such as electrons, within atoms and…
Q: How to Prevent Electronic Electrostatic Discharge (ESD)
A: Prevent Electronic Electrostatic Discharge (ESD) by being aware of the phenomenon that occurs when two objects with different electrical potentials come into contact and then separate, resulting in a sudden flow of electricity between them. This flow of electricity, known as a discharge, happens…
Q: What is Electrostatic Discharge (ESD)
A: Electrostatic discharge (ESD) is a sudden flow of electric current between two objects that have accumulated an imbalance of electric charge. This phenomenon occurs when there is a difference in electric potential (voltage) between the objects, causing a rapid transfer of electrons from one…
Q: What’s PCB Cleaning After SMT Assembly
A: After Surface Mount Technology (SMT) assembly, the printed circuit boards (PCBs) often need to undergo a cleaning process to remove any flux residues, soldering paste, and other contaminants that might be present on the board’s surface. Cleaning the PCBs is crucial to ensure their…
Q: What is a PCB Solder Mask
A: A PCB solder mask, also known as solder resist or solder stop mask, is a protective layer applied to the surface of a PCB to insulate and prevent solder from unintentionally bridging or short-circuiting the electrical connections on the board during the soldering process….
Q: What are Wire Termination Methods
A: Wire termination methods refer to connecting the end of an electrical wire to a terminal or a connection point to establish a secure and reliable electrical connection. Termination is a crucial step in wiring and electrical installations, as it ensures that electrical current can…
Through-Hole Versus Surface Mounting
In recent years, semiconductor packaging has advanced with an expanded demand for more extensive functionality, smaller size, and added value. A modern PCB assembly design has two central methods for mounting components onto a printed circuit board: Through-Hole versus Surface Mounting. Through-hole components are mounted…
Q: What Determines Solder Joint Strength
A: The solder joint strength is not determined by whether they are “leaded” or “non-leaded” but by factors such as the solder composition, joint design, and application method. Leaded solder typically contains a small amount of lead, which helps to lower the melting temperature and…
Q: What is Zero Defects Concept
A: Zero defects is a concept in quality management that aims to achieve perfection by eliminating all defects or errors in a product or process. It involves a proactive and systematic approach to identify and eliminate any potential sources of defects. The goal is to…