Q: What are PCB Solder Bridges
A: PCB Solder bridges, also known as solder shorts or solder blobs, are unintended electrical connections created by excess solder material that connects two or more adjacent conductive elements on a printed circuit board (PCB) or electronic component. These connections can cause electrical problems and…
Q: What is Solder Paste Slump
A: Solder paste slump refers to the tendency of solder paste to change in consistency and flow characteristics over time, particularly during storage or during the soldering process. Solder paste is a critical material used in surface-mount technology (SMT) for attaching electronic components to printed…
PCB Design Rule Checking (DRC): 8 Aspects
PCB Design Rule Checking (DRC) for Printed Circuit Boards is critical in the design and manufacturing process. It involves the automated verification of a PCB design against predefined rules and constraints to ensure that the design meets the required specifications and can be manufactured correctly….
PCB Substrate Delamination: Causes
PCB substrate delamination of a printed circuit board occurs when the layers of the board separate or peel apart from each other. This can be a significant issue in electronic manufacturing and can result from various factors, including: PCB substrate delamination prevention requires following proper…
Stop Solder Dewetting: Causes and Prevention
Solder dewetting is a common issue in soldering processes, particularly in electronics manufacturing, where solder joints lose their integrity and wetting ability, leading to a reduction in solder adhesion to the surfaces being soldered. This can result in poor electrical connections, reduced mechanical strength, and…
ANZER… Trusted Electronic Services Partner
Once upon a time, in the bustling city of Siliconville, there was a young and ambitious engineer named Sparky. Sparky had a dream and a vision to create revolutionary electronic devices to change the world. But to bring this vision to life, he needed a…
Q: In-Circuit Test (ICT): Why so Important
A: In-circuit test (ICT) is a widely used electronic testing method in the manufacturing and quality control of printed circuit boards (PCBs) and electronic assemblies. ICT is designed to identify defects and verify the functionality of individual components and connections on a PCB while it…
What about PCB Solder Flux Residue
PCB solder flux residue refers to the leftover material that remains on the surface after soldering. Solder flux is a chemical substance used in soldering processes to improve the quality and reliability of solder joints. Let’s start with the purposes of solder flux: There are…
Q: What is Mid-Chip Solder Balling
A: Mid-chip solder balling is a phenomenon that can occur during the soldering process in electronic assembly, particularly in surface mount technology (SMT) soldering. It refers to forming small, spherical solder balls or droplets that appear near the center of a solder joint on a…
PCB Assembly: Key Performance Indicators
Key Performance Indicators (KPIs) are quantitative or qualitative metrics used to assess the performance and effectiveness of various processes within electronics assembly. These KPIs help organizations track their progress, identify areas for improvement, and make informed decisions. In electronics assembly, some common Key Performance Indicators…
Electronics Assembly Inventory Tracking
Electronics assembly inventory tracking systems are software or technology solutions designed to manage and monitor the inventory of electronic components and materials used to assemble electronic devices. These systems play a crucial role in ensuring efficient production processes, preventing shortages, minimizing excess stock, and maintaining…
Implementing Corrective Actions in PCB Assemblies
Implementing corrective actions in PCB (Printed Circuit Board) assemblies involves identifying and addressing issues that arise during the manufacturing, testing, or operational phases. These actions ensure that the final product meets quality standards and functional requirements. Here’s a general process for implementing corrective actions in…
Electronic Assembly Root-Cause Analysis Explained
Electronic assembly root-cause analysis is a systematic process used to identify and understand the underlying reasons or factors contributing to defects, failures, or issues in electronic assemblies or products. Electronic assemblies typically refer to complex systems comprising various interconnected electronic components, such as printed circuit…
Q: What is a Certified IPC Application Specialist
A: The IPC-7711/7721 Certified IPC Application Specialist (CIS-AS) is a certification program offered by IPC. This program trains individuals to properly apply the IPC-7711/7721 standard for electronic assembly repair and rework. Participants who complete the program and pass the certification exam demonstrate their proficiency in…
Electronic Manufacturing Industry & ITAR
The International Traffic in Arms Regulations (ITAR) is a set of United States government regulations that control the export and import of defense-related articles, services, and technical data. ITAR primarily concerns items and information related to defense and military technology. The U.S. Department of State…
MIL-STD-202: Reliability & Durability Testing
MIL-STD-202 is a United States Military Standard that outlines test methods and procedures for the environmental and mechanical testing of electronic and electrical components and equipment. This standard aims to establish uniform test methods to evaluate the performance and reliability of these components and equipment…
Purpose of PCB Vibration Testing
PCB vibration testing, also known as Printed Circuit Board vibration testing, is a process used to assess the durability, reliability, and performance of electronic components mounted on a PCB (Printed Circuit Board) when subjected to various mechanical vibration levels. This type of testing is especially…
Electronic Manufacturing Equipment Calibration Importance
Manufacturing equipment calibration is a process used to ensure that measurement and testing instruments used in manufacturing processes are accurate and provide reliable results. Calibration involves comparing the measurements taken by a particular instrument to a known, standardized reference value. If any discrepancies are found,…
Electronic Manufacturing Equipment Traceability Described
Electronic manufacturing equipment traceability refers to the ability to track and document the various stages and components involved in the manufacturing process of electronic products. It involves capturing and recording information about the materials, processes, and personnel involved in producing electronic devices, such as printed…
Center of Quality: Association Connecting Electronics Industries (IPC)
IPC certifications are industry-recognized credentials for electronics manufacturing and repair professionals. They are awarded by the Association Connecting Electronics Industries (IPC) and signify expertise in various aspects of electronics assembly, repair, and quality control. Some standard IPC certifications include: 1. IPC-A-610: Acceptability of Electronic Assemblies…