Q: What is Solder Paste Silk-screening in SMT Components Assembly
A: Solder paste silkscreening is used in electronics manufacturing to apply solder paste onto printed circuit boards (PCBs) before soldering components inSMT components assembly. It involves using silkscreen or stencil to deposit a controlled amount of solder paste onto the PCB’s pads. This paste acts as a temporary adhesive that holds surface mount components in place before they are soldered. Once the components are positioned, the entire PCB is heated, causing the solder paste to melt and create solid electrical connections. This process is crucial in surface mount technology or SMT components assembly.
Read our 10-page whitepaper, ANZERs to Understanding Printed Circuit Board Assembly, to learn about the PCB assembly process.