PCB Assembly: Components on Both Sides
Design for Manufacturability
Surface Mount Technology (SMT) components can be placed on both sides of a printed circuit board (PCB) for several reasons:
- Space Efficiency: Placing SMT components on both sides of the PCB allows more components to be placed in a smaller footprint. This is particularly important in modern electronics, where miniaturization is a crucial design goal.
- Component Density: Some PCB designs require a high component density to meet specific functionality and performance requirements. Placing components on both sides of the board increases the available area for placing parts, increasing the overall component density.
- Thermal Management: Certain components, such as power semiconductors (e.g., voltage regulators or FETs), generate a significant amount of heat during operation. Distributing these components on both sides of the PCB can help dissipate heat more effectively, preventing localized overheating.
- Signal Routing: Placing components on both sides of the PCB can facilitate more efficient signal routing. This is especially important when dealing with complex PCB layouts where signal traces must travel across different board parts.
- Mixed Technology Assemblies: Some PCBs incorporate surface-mount and through-hole components for various reasons, such as compatibility with older technology or specific functional requirements. In such cases, components are placed on both sides to accommodate SMT and through-hole components.
- Mechanical Considerations: In some designs, SMT components on one side of the PCB may need to be paired with through-hole components on the other side for mechanical stability and support. This is common in applications where the PCB is attached to a chassis or enclosure.
- Cost and Manufacturing Efficiency: Depending on the manufacturing process and equipment used, distributing components on both sides of the PCB may be more cost-effective or efficient. This can reduce the number of manufacturing steps and use automated pick-and-place machines more efficiently.
- Electromagnetic Interference (EMI) Control: Placing components on both sides can help manage EMI issues by allowing designers to create dedicated ground planes and shielding arrangements on one side of the board while placing sensitive parts on the other.
Not all PCBs require components on both sides, and the decision to use both depends on the specific design requirements and constraints. Additionally, designers must carefully consider factors like signal integrity, thermal management, and assembly processes when deciding how to place SMT components on a PCB.
To learn more about PCB Assembly, read our WHITEPAPER!
Jayesh Mendpara
Jay (ANZER CEO) has an MS in Computer Science and has worked in the Information Technology (IT) field for almost 20 years. He is an IPC-certified trainer who oversees all manufacturing operations, employee communications, and quality policy implementation. Jay continuously analyzes customer requirements for highly efficient manufacturing and process equipment investments.